MGA: Ceramic SMT Fuse – Ultra-Compact Time-Lag Characteristic for Demanding Environments

Rated Voltage

32 - 125 VAC, 125 VDC

Rated current

0.2 - 5 A

Breaking Capacity

50 A

Characteristic

Super-Quick-Acting FF

Mounting

PCB,SMT

Admissible Ambient Temp.

-55 °C to 150 °C

Climatic Category

55/150/21 acc. to IEC 60068-1

Material: Housing

Ceramics

Material: Terminals

Tin-Plated Nickel

Unit Weight

0.03 g

Storage Conditions

0 °C to 60 °C, max. 70% r.h.

Product Marking

none

Soldering Methods

Reflow, Wave
Soldering Profile

Solderability

245 °C / 3 sec acc. to IEC 60068-2-58, Test Td

Resistance to Soldering Heat

260 +0/-5 °C / 30 sec acc. to IPC/JEDEC J-STD-020D, Level 1

Moisture Sensitivity Level

MSL 1, J-STD-020 

Flammability

min. UL 94V-1
(acc. to EIA/IS-722, Test 4.12)

Moisture Sensitivity Level

MIL-STD-202, Method 106
(50 cycles in a temp./mister chamber)

Thermal Shock

MIL-STD-202, Method 107D
(200 air-to-air cycles from -55 to +125°C)

Operational Life

MIL-STD-202, Method 108
1000h @ 0.60 x In @ 70°C

Load Humidity Test

MIL-STD-202, Method 103
0.1 x In @ 0.85 r.H. @ 85°C

ESD classification

JEDEC JS-001-2014, Class 1B 
 (500 to < 1000 V)

Resistance to Solvents

MIL-STD-202, Method 215

Terminal Strength

MIL-STD-202, Method 211A
(Deflection of board 1 mm for 1 minute)